Suneast WBD2200 IC Bonder

Placement accuracy: ±15um@3σ

Placement anqle accuracy: ±0.1°@3σ

Wafer size(mm): 4"/6"/8"(Option：12")

Die size(mm): 0.25*0.25mm~10*10mm

Substrate size(mm): L150×W50~L300×W100

Substrate thickness(mm): 0.1~2mm

Placement head: 0-360°rotation/Auto change nozzle(option)

Placement pressure(N): 30~7500kg

Force control accuracy: 30g-250g:±10g; 250g-7500g:±5%

Glue feeding mode: Support：dispensing， dipping glue， painting glue

Core motion module: Linear motor+grating scale

Platform base of machine: Marble platform

Loading/unloading: Manual/auto

Machine dimension(L×W×H): 1255mm×1625mm×1610mm

*Remarks: Customization is supported