Suneast WBD2200 PLUS IC Bonder

Placement accuracy:±15um@3σ

Placement angle accuracy:±0.3°@3σ

Force control range: 20-1000g(with different configurations,the maximum support is 7500g)

Force control accuracy:20g-150g:±2g; 150g-1000g:±5%

Silicon wafer processing(mm):Max 12""(300mm), compatible with 8""(150mm)

Die size(mm):0.25*0.25mm-10*10mm

Loading/Unloading:Manual/auto

Applicable material box(mm):L：110-310 W：20-110 H：70-153

Applicable lead frame(mm):L：100-300 W：38-100 H：0.1-0.8

Glue feeding mode:Dispensing+painting glue

Core module movement mode:Linear motor + grating scale

Bottom photo-taking:Option

Machine dimension(L×W×H):2480mm×1470mm×1700mm

Weight:Approx.1800kg

*Remarks: Customization is supported

 Datasheet