Suneast CBD2200 IC Bonder

Placement accuracy: ±10um@3σ

Placement angle accuracy: ±0.3°@3σ

Loading mode: Wafer box

Die size(mm): 0.25*0.25mm-10*10mm

PCB size(mm): L300*W100

Placement head: 0-360°rotation/Auto change nozzle(option)

Placement pressure(N): 30-500g

Glue feeding mode: Support: dispensing, dipping, painting

Core motion module: Linear motor + grating scale

Platform base of machine: Marble platform

Machine dimension(L×W×H): 1610mm×1380mm×1620mm

*Remarks: Customization is supported