Suneast CBD2200 EVO IC Bonder

Placement accuracy: ≤+10um@3σ

Placement angle accuracy: ±0.15°@3σ

Force control range: 20~1000g (with different configurations,the maximum support is 7500g)

Force control accuracy: 20g-150g:±2g; 150g-1000g:±5%

Substrate pallet size(mm): L200XW90~150

Tray size(mm): Based on customer products

Loading/Unloading: Manual /auto

IC dimension(mm): L0.25*W0.25-L10*W10

IC supply: Waffle tray

Core module movement mode: Linear motor+grating scale

Glue feeding mode: Dispensing+painting glue

Auto change nozzle: Seven

Bottom photo-taking: Equipped with camera

Machine dimension(mm): L(1400)*W(1250)*H(1700)

Weight: Net weight of equipment:Approx.1500Kg

*Remarks: Customization is supported