QUICK A200T SMT & Solder Joint AOI (171CM²/s)

Optical imaging system

Top/bottom camera: 5 MP/12MP high-speed camera

Light source: Multi-angle high intensity light source

Optical resolution: 4.3μm/10μm/15μm/20μm

Inspection speed: Up to 171CM²/s（15um)

Defect inspection

Component defect: Missing parts, tombstoning, billboard, polarity, rotation, skew, OCV, damage, reverse, tilt, foreign matter, solder float, component height

Soldering joint defect: Icicle, hole, solder bead, pad with less/more solder, bridging, warping, gold finger pollution/scratches, solder joint height, volume, sectional area, roundness

Mini Led defect: multiple die, missing die, upside down, reversed, shift, billboard, die lifting, rotation, dead led, foreign matter, internal shorting, solder shorting, cold soldering

X-Y-Z axis control system: High-precision ball screw drive

X-Y-Z axis control accuracy: 10 μm

Min PCB carrier size: 50 x 50 mm

Max PCB carrier size:

Single track: 470 x 510 mm

Dual track: 510x580mm (Enable single track）

510X330mm (Enable dual track）

PCB measurable thickness: 0.6-5 mm

PCB conveyor height: 880-920 mm

Conveyor loading weight: 8 kg

Conveyor width adjustment/conveying: Automatic width adjustment, belt conveying

Height limit of passable component:

Top A200T/T-D： 28-50mm adjustable

Bottom A200T/T-D： 60mm

Side 3 mm

Weight: 750 kg/-D model 900kg

Power requirements: 200-240 V, single phase, 50/60 Hz, 3 kVA

Air source: 5-6 bar

Software: Offline programming software, maintenance station software, SPC, MES docking software, deep learning software (optional)

Datasheet