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MC-301N Batch Reflow Oven - Specifications | |
Applicable Solder Types | Lead-Free or SnPb |
Heating Method | IR & Forced Hot Air Convection |
User Interface | Android Software Platform |
Effective Soldering Area | 9.84" x 7.87" (250 x 200 mm) |
Heating Chamber Size | 13.78" x 9.84" (350 x 250 mm) |
Temperature Range | Ambient - 310 °C |
Temperature Precision | ±2 °C |
Temperature Control Method | PID Control; SSR Contactless Switch Circuit |
Warm-up Time | approx. 2.5 min. |
Power | 3.6 KW (avg.); 6.3 KW (max.) |
Voltage | 220 V, Single Phase, 50/60 Hz |
Exhaust Requirement | 6.3 L/Min., .22 CFM |
Exhaust Temperature (approx.) | 90°C |
Dimensions | 27.2" L x 18.9" W x 11" H |
Weight | approx. 88 lbs. (40 Kg) |
