Harwin G125-FS11605F3P Conn Wire to Board RCP 16 POS 1.25mm Solder ST SMD T/R
ManufacturerHarwin(View more products from this manufacturer)
ModelG125-FS11605F3P
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Type: Wire to Board
Pitch: 1.25 mm
Gender: Receptacle
Mounting: Surface Mount
Lead Finish: Gold over Nickel
Housing Color: Green
Product Depth: 4.9 mm
Number of Rows: 2
Product Height: 5.24 mm
Product Length: 21.45 mm
Contact Plating: Gold
Body Orientation: Straight
Contact Material: Phosphor Bronze
Number of Contacts: 16
Product Dimensions: 21.45 x 4.9 x 5.25 mm
Termination Method: Solder
Max Processing Temp: 260 °C
Operating Temperature: -65 to 150 °C
Maximum Contact Resistance: 25 mOhm
Maximum Current Rating/Contact: 2 A
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