FISCHER FISCHERSCOPE X-RAY XDV-μ WAFER Coating Thickness Meter (Ø 10 µm halofree*)

Special device for automated measurements on wafers ranging from 6 to 12 inches in diameter

Microfocus tubes with molybdenum anode as standard, tungsten anode optionally available

4-fold automatically exchangeable filter

Optimal local resolution; halo-free polycapillary optics enable measuring spots of 10 or 20 µm FWHM

Silicon drift detector for maximum precision on thin layers

Precise, programmable measuring stage with vacuum wafer chuck for automated measurements on small structures

Applications

Au/Pd/Ni/CuFe and Sn/Ni coatings in the micro- and nanometer range

Assembled and unassembled circuit boards

Testing of base metallization layers (under-bump metallization, UBM) in the nanometer range

Measurement of light elements, e.g. determination of the phosphorus content (in ENEIG/ENEPIG) under Au and Pd

Lead-free solder caps on copper pillars

Testing the elemental composition of C4 and smaller solder bumps, as well as small contact surfaces in the semiconductor industry

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