ESPEC TSD-100 Thermal Shock Chamber (60~300°C, -65~0°C, Plastic mold IC 5kg)

Test area:

High-temp. exposure range: +60 to +300°C

Low-temp. exposure range: -65 to 0°C

Hot chamber:

Temperature pull-down time: Within 100 minutes from ambient temperature to +300°C

Cold chamber:

Temperature pull-down time: Within 90 minutes from ambient temperature to -77°C

Temperature recovery performance:

Condition:

High temperature exposure: +270°C (40 minutes)

Low temperature exposure: -40°C (40 minutes)

Specimen: Plastic mold IC 5 kg

Temperature recovery time: Within 5 minutes

Test area dimensions (mm): W710×H345×D410

Datasheet