CTS Electronic Components BDN11-3CB/A01 Heat Sink Passive BGA/PGA/PLCC/QFP Extruded PCB Mount 20.9°C/W Aluminum
ModelBDN11-3CB/A01
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Type: Passive
Material: Aluminum
Mounting: PCB Mount
Fin Style: Extruded
Series Name: BND
Device Cooled: BGA|PGA|PLCC|QFP
Attachment Method: Adhesive Tape
Product Dimensions: 28.19 x 28.19 x 9.02 mm
Thermal Resistance: 20.9 °C/W
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