Asahi SN99.3 CU0.7 Lead Free Solder (0.8mm; 500g)
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Composition
- SN: 99.3%
- Cu: 0.7%
Flux content in core: 1-3%
Flux Content
- Pine resin 85-95%
- Activator: 5-10%
Boiling Point: 124°C (flux)
Melting point: 227°C (solder)
Specific temperature (water = 1 at 25°C): 7.31 (solder)
Weight: 500g
Diameter ϕ: 0.8/mm
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